The 6th Shenzhen International AI Computing Power and Data Center Liquid Cooling Technology Exhibition, along with the Thermal Management and Heat Dissipation Expo, officially opened today at the Shenzhen International Convention & Exhibition Center!

Release time:

2026-06-12

At present, the wave of large AI models is sweeping the globe, and high-performance computing is driving an explosive surge in demand for computational power. Liquid cooling technology is rapidly evolving from a “nice-to-have” option in data centers to an essential requirement. Under the dual impetus of the “dual carbon” goals and energy security,

The 6th Shenzhen International AI Computing Power and Data Center Liquid Cooling Technology Exhibition, along with the Thermal Management and Heat Dissipation Expo, officially opened today at the Shenzhen International Convention & Exhibition Center!

At present, the wave of large AI models is sweeping the globe, and high-performance computing is driving an explosive surge in demand for computational power. As a result, liquid cooling technology is rapidly evolving from a “nice-to-have” to an essential requirement in data centers. Under the dual impetus of the “dual carbon” goals and energy security, computing power has become the core engine of the digital economy, while liquid cooling and an open ecosystem serve as its twin pillars for sustainable development.

At this pivotal juncture of industrial transformation, the “2026 Shenzhen International AI Computing Power Industry Exhibition,” the “6th Shenzhen International Data Center Liquid Cooling Technology Exhibition,” and the “16th Shenzhen International Thermal Management Materials and Equipment Exhibition”—jointly organized by Shenzhen Liyue Exhibition Co., Ltd. and Bohan Exhibition (Shenzhen) Co., Ltd.—will open simultaneously from June 10 to 12, 2026, at Halls 14 and 16 of the Shenzhen International Convention & Exhibition Center. For the first time, these three flagship events will be held in tandem, spanning the entire value chain of AI computing infrastructure, liquid cooling technologies, and thermal management materials, thereby creating a comprehensive industry showcase that seamlessly connects upstream and downstream sectors.

Use exhibitions to boost production and break down barriers to collaboration across the industrial chain.

This year’s exhibition is anchored in the Guangdong–Hong Kong–Macao Greater Bay Area—the nation’s premier hub for the digital economy and artificial intelligence industries—bringing together a vast array of computing‑power operators, cloud service providers, technology firms, and research institutions. It boasts a fully integrated industrial ecosystem, spanning everything from chips and servers to liquid‑cooling systems and thermal‑management materials. By adopting a three‑exhibition collaborative model, the event enables computing‑equipment manufacturers, liquid‑cooling solution providers, thermal‑material suppliers, and end users to connect efficiently on a single platform, significantly reducing communication and transaction costs across the industry chain.

For liquid‑cooling technology providers, the exhibition offers a targeted platform to engage directly with AI computing operators and cloud‑vendor procurement decision‑makers, helping accelerate the transition of liquid‑cooling solutions—such as cold‑plate and immersion systems—from the lab to large‑scale deployment. For thermal‑management materials companies, the event brings together buyers from consumer electronics, semiconductors, the automotive industry, aerospace, 5G terminals, and other sectors, providing an efficient pathway for market validation of new materials and innovative processes.

Facilitate research through conferences, fostering consensus on technological roadmaps.

Held concurrently with the exhibition, the “IDC 2026 6th Shenzhen International Data Center Liquid Cooling Technology Summit Forum” (June 10–11) will bring together industry-leading experts, technical heads from top-tier companies, and scholars from research institutions to engage in in-depth discussions on cutting-edge topics such as the evolution of liquid cooling technology pathways, challenges and solutions for AI computing‑power cooling, and the large‑scale deployment of cold‑plate and immersion liquid cooling. The forum aims to provide valuable insights for industry decision‑making, foster consensus on technical standards, interface specifications, and energy‑efficiency evaluation, and accelerate the transition of liquid cooling technology from being merely “usable” to being “highly effective.”

Gathering ecosystems through exhibitions, forging a new landscape of open collaboration.

This year’s exhibition attracts a diverse audience spanning consumer electronics, power supplies, the automotive industry, semiconductors, defense and aerospace, optoelectronics, aerospace, AI, 5G terminals, and smart automation—alongside government agencies, research institutions, equipment manufacturers, traders, distributors, and end‑users. This multifaceted attendee base ensures that the event serves not only as a showcase for cutting‑edge products but also as a platform for cross‑industry technological innovation, ecosystem‑partner matchmaking, and the exploration of new business models.

Computing power drives the future, while liquid cooling defines efficiency. Through the coordinated synergy of three exhibitions—leveraging trade shows to boost production, conferences to advance research, and events to foster an ecosystem—this initiative goes beyond a mere showcase of technologies and products; it represents a pivotal industry-wide effort to steer China’s computing‑power and liquid‑cooling sectors toward greener, higher‑performance solutions. As the event unfolds, we look forward to all stakeholders working together to deepen the integration of liquid cooling and computing power, injecting fresh momentum into the sustainable development of the digital economy.

IDC x CIME 2026

Exhibition Duration:

Wednesday, June 10, 2026 / 9:00 a.m. – 5:00 p.m.

Thursday, June 11, 2026 / 9:00 a.m. – 5:00 p.m.

Friday, June 12, 2026 / 9:00 AM–3:30 PM

Note: Exhibitors must enter the venue by 8:30 a.m. each day.

Exhibition Venue:

Hall 14 & Hall 16, Shenzhen International Convention & Exhibition Center (North Registration Lobby)

(No. 1, Zhancheng Road, Fuhai Subdistrict, Bao’an District, Shenzhen)

North Registration Hall – East Entrance, Shenzhen International Convention & Exhibition Center

CIME 2026 Exhibition Hall Layout

Proposed Participating Procurement Enterprises for CIME2026

Server turnkey solutions, operators/solution providers;

R&D and manufacturing of liquid cooling plates;

Data center turnkey solutions provider;

New energy vehicles;

Power batteries and energy storage;

Materials company;

Processing enterprise;

CIME2026 Audience Profile

1. Consumer electronics, power supplies, the automotive industry, electronics, household appliances, computers and computer components, etc.;

2. Displays, semiconductors, defense‑related products, optoelectronics/LEDs, inverters, the machinery industry, aerospace, and more;

3. Computers, information technology, telecommunications, 3C/digital products, communication equipment, computer peripherals, and related items;

4. Electronic equipment, electronic components, instruments and meters, communication/telecommunication networks, power electronic devices, etc.;

5. Printed circuit board manufacturers, AI, 5G terminals, smart automation, and more;

6. Government agencies, research institutions, equipment manufacturers, traders, agents, distributors, end users, and others;

CIME2026 Transportation Guide

How do I get to the exhibition hall?

1. Aviation

Shenzhen Bao’an International Airport: Take Metro Line 11 (toward Bitou) to Airport North Station, then transfer to Line 20 (toward Convention & Exhibition City) and alight at Guozhan North Station; from there, exit directly into the exhibition hall.

Hong Kong International Airport: Take public transportation, such as cross-border buses or ferries, to Shenzhen, then transfer to local public transport to reach the exhibition venue.

Guangzhou Baiyun International Airport: Take public transportation, such as high-speed rail or bus, to Shenzhen, then transfer to local public transit to reach the exhibition venue.

2. Subway

Subway Line 12: Take Subway Line 12 to Guozhan Station or Guozhan North Station to reach the exhibition venue (connections are available with Lines 1, 2, 5, 9, 11, and 20).

Metro Line 20: Take Metro Line 11 to Airport North Station, transfer to Line 20, and alight at National Exhibition Center Station or National Exhibition Center North Station to reach the exhibition venue (approximately 6–8 minutes). For specific access, use the east side of the North Entrance Hall (Exit C at National Exhibition Center North Station), the South Entrance (Exit D at National Exhibition Center North Station), or exit directly into the exhibition hall.

3. For taxis or ride-hailing services, please show the driver the exhibition address: Shenzhen International Convention & Exhibition Center (Bao’an New Hall), North Entrance Lobby, No. 1 Zhancheng Road, Fuhai Subdistrict, Bao’an District, Shenzhen, Guangdong Province. From Terminal 3 of Shenzhen Bao’an International Airport, the journey takes approximately 25 minutes. From Shenzhen North Station, it takes about 60 minutes. From the Shenzhen Airport Pier, it takes roughly 25 minutes. From Futian Port, the drive takes around 60 minutes. And from Shenzhen Bay Port, it takes approximately 40 minutes.

4. Bus routes: Bus B892 runs from Qiaotou Comprehensive Terminal to the Shenzhen International Convention and Exhibition Center. Bus M515 runs from Fuyong Health Supervision Station to the Shenzhen International Convention and Exhibition Center. Bus 615 runs from Liuxian Road to the Shenzhen International Convention and Exhibition Center.

5. If driving, set your destination to “Shenzhen International Convention & Exhibition Center Parking Lots P1/P5.” Please park in Areas C, F, or G for a faster visit!

Shenzhen City—Passenger vehicles with non-Shenzhen license plates ✦ Recommended routes: 🚗S3 Yanjiang Expressway → International Convention and Exhibition Center toll plaza → Fengtang Avenue → Zhanjing Road → Binjiang Avenue 🚗S3 Yanjiang Expressway → Fuhai toll plaza → Fuzhou Avenue → Zhanyun Road → Zhanjing Road → Binjiang Avenue

✦ Traffic Restriction Hours: ★ At present, certain time periods in Shenzhen impose restrictions on vehicles with out-of-town license plates. If you plan to drive a non-Shenzhen‑registered car during the exhibition and need to enter restricted road sections, please avoid traveling during the following hours: Monday through Friday (weekdays), 7:00–9:00 a.m. (morning rush hour) and 5:30–7:30 p.m. (evening rush hour).

★ Please follow the “Shenzhen Traffic Police” WeChat official account and apply for a temporary entry permit to Shenzhen yourself (you can only apply once per month, and the permit is valid only for the current day and the following month).